Board

 

Full service board assembly:

In our ISO9001 certified facility, we can assemble your boards from A-Z. Our service is quite simple: we make it how you designed it. Whether it’s a quick turnaround you are looking for or a full year’s forecast we have solutions to fit each individual customer.

We have both RoHs compliant and non-RoHs lines in our facility to better serve your needs.

We will save you money on your board/wire and cable harness builds and our quality is impeccable.


HDI Capabilities:

Feature Laser via PCB Capability
Mass Production Sample Run
(Normal lower cost) (High Value normal) (High Value higher cost) (Small value)
Line/space width
(trace layers)
.005″/.005″ .004″/.004″ .003″/.003″ .0025″
Line/space width
(HDI layers)
.005″/.005″ .004″/.004″ .003″/.003″ .0025″
Drill via size
(PTH)
.010″ .010″ .010″ .008″
Drill capture pad
(PTH)
.022″ .020″ .018″ .016″
Micro via size
(unfinished)
RCC .004″ .004″ .004″ .003″
Micro capture pad .014″ .012″ .011″ .009″
Micro via size
(unfinished)
PP .005″ .004″ .004″ .003″
Micro capture pad .014″ .012″ .011″ .010″
Aspect ratio (PTH) 0.334027778 0.375694444 0.417361111 0.459027778
Aspect ratio (Micro via) 0.6:1 0.8:1 0.9:1 0.042361111
Layer to layer
registration
±5mil ±4mil ±3mil ±2mil
Impedance control ±10%(±5Ω) ±10%(±4Ω) ±7%(±3Ω) ±5%(±2.5Ω)

 

Rigid board production:

Materials: FR4, FR4 Tg150, Tg170 and T80, Halogen free FR4, Rogers, Teflon, Arlon, Metal Based [Aluminium, Copper], Mix material
Layer account: 1-38
PCB final thickness: .005″ to .315″
Min. trace: .003″ – Min. space .003″
Min. finished hole size: .004″(laser drilling), 0.006″(mechanical drilling)
Start copper weight: 1/3 to 28oz
Surface finish: HASL, HAL Lead Free, OSP, Immersion Gold, Immersion Silver, Gold Flash, Immersion Tin, Selective Gold(Au: 50uinch), Gold Fingers [Au: 3-50uinch)
  • Controlled impedance, unbalanced dielectric thickness.
  • Plated slots and edges.
  • Peelable mask, Carbon ink, Capton tape.
  • Conductive silver/carbon filled via.
  • Counter sink, Tapped hole.
  • Blind via, buried via, via in pad, HDI[1+N+1, 2+N+2, 3+N+3].

 

Rigid board tolerances

  • Copper to edge of PCB:
    • Routing: Min. 0.008″for outer layer and 0.014″ for inner layers [0.020" preferred for inner layers]
    • V-cut: Min. 0.015″ for outer layers and 0.020″ for inner layers
  • Pad size/Annular ring
    • Pad size – + 0.006″ over finished via size
    • + 0.012″ over finished component hole size
  • Annular ring [radius of the pad]
    • + 0.003 for via
    • + 0.006″ [Min.] for component holes
  • Hole size
    • PTH =/-0.002″, NPTH +/-0.001″ based on 1 oz and 2 oz
    • Min. finished hole size: 0.004″
  • Rout/Punch [Board outline]
    • +/- 0.004″ for production

Note: rout/Punch to board size using the center of the board outline on mask layer


PCB finished thickness

  • Overall may vary +/- 10% [Min. +/- .004"]
    • 2Layer: 0.005″ – 0.236″
    • 4Layer: 0.020″ – 0.315″
    • 6Layer: 0.031″ – 0.315″
    • 8Layer: 0.047″ – 0.315″
    • 10Layer: 0.062″ – 0.315″
  • Inner layer clearances: Min. 0.008″
  • Inner layer thickness tolerance: +/-0.001″
  • Trace width/spacing
    • 0.5oz finished Min. trace/space 0.003″ [inner and outer]
    • 1oz finished Min. trace/space 0.004″ [inner and outer]
    • 2oz finished Min. trace/space 0.008″ [inner and outer]
    • 3oz finished Min. trace/space 0.010″ [inner and outer]
    • 4oz finished Min. trace/space 0.012″ [inner and outer]
  • Solder mask swell [expansion of mask over pad area]
    • Min. 0.005″ over pad size or 0.0025″ each side
  • Slot width Min. 0.031 by routing in width, Min. 0.016″ PTH by drilling tolerance +/-0.003″
  • Tab rout spacing Min. 0.040″ spacing between individual boards for tab rout spacing
    • Min. 0.015″ for scoring
  • Silkscreen [legend] Min. 0.005″ line width

 

Flex PCB Production

Flex board: 1-6 layers
Rigid-flex board: 2-12 layers
Base materials Flex: Capton, PI, PET
Rigid: FR4

Base film thickness

Flex: 12.5-50um
Rigid: 0.1 – 3.2mm
Coverlay thickness: 12 – 25um
Adhesive thickness: 12 – 35um
Base copper thickness: Ω – 1oz. [RA/ED copper]
Stiffner materials: PI, PET, FR4, SUS

Min. finished thickness

Single sided: 0.075mm/0.0035″
Double sided: 0.13mm/0.005″
Multilayers: 0.31mm/0.012
Max. panel size: 250mm x 550mm/9.8″ x 21.65″
Min. drill size: 0.15mm/0.006″
Blind or buried via: Yes for rigid-flex board
Min. line width/spacing: 0.05mm/0.002″


Flex PCB tolerance

Min. bonding pitch: 0.10mm/0.004″[Center to Center]
Min. SMT pitch: 0.40mm/0.016″[Center to Center]
Surface finishing: ENIG, HAL, Immersion Tin,
Plated soft gold, Selective hard gold, OSP
Silver ink or Carbon ink
Outline: Punching, CNC Routing & V-scoring only for rigid part
Min. hole diameter tolerance: +/-0.002″
Min. hole position tolerance: +/-0.002″
Min. pattern registration tolerance: +/-0.002″
Min. solder mask registration tolerance: +/-0.003″
Min. annular ring: 0.001″
Min. solder mask bridge [LPI]: 0.008″
Twist and warp: 1%
E-Testing voltage: 24V-3000V
Continuity: 5-100ohms
Flying Probe E-tester and AOI available